Hardness Indenter

A hardness indenter is available for harness measurements to the researcher doing work at MIBL. It is a new system that is computer controlled with the capability of automatic measurments. 

Vacuum Furnace

A vacuum furnace provides heat treating and annealing capability in this cryopumped sys-tem. Samples are placed in a 6 cm diameter, 65 cm long quartz tube which is evacuated with a sorption pump and cryopump combination. The tube is inserted into a tube furnace (mounted on a track) by rolling the tube furnace over the quartz tube to position the samples in the center of the hot zone. The maximum temperature attainable in this system is 1100°C at 10 -8 Torr. 

Thermal Imager

The thermal Imager (the Stinger) - manufactured by Ircon Inc. is capable of delivering amazing temperature details of the surface of the samples during irradiations. The imager's range is from room temperature to 13000 C and the surface resolution is in the micron range for its distance (10 inches) from the samples.
Below is shown a view from the Stinger of the irradiated surface.

Profilometer

The Dektak3 is a precision profilometer which operates in a Microsoft Windows environment and is routinely used to measure film thickness, surface roughness, and substrate curvature. All measurements are made electromechanically by moving the specimen beneath a diamond-tipped stylus. The stylus tracking force is adjustable within the range of 0.1 mN to 0.4 mN. The vertical range of the instrument is from 10nm to 66um, with a vertical resolution of 1nm. The horizontal resolution is a function of the selected scan length and scan speed. The high-precision stage moves a specimen beneath the stylus according to a user-programmed scan length and speed. Scan programs may be stored on the hard drive for later use 

Residual Stress Measurement System 

The scanning laser reflection system is used for thin film residual stress measurement. It consists of a 5 mW He-Ne laser, optical components to guide the laser beam, a DC motor driven sample stage, and an X-Y optical position detector. Both sample stage motion control and data acquisition are achieved via a PC compatible computer using custom software. This technique provides rapid analysis of film stresses without contact of the film or substrate.