Engineering Research Center for Wireless Integrated MicroSystems
In September 2000, the University of Michigan became the site of the nation's first Engineering Research Center for Wireless Integrated MicroSystems (ERC/WIMS) under a designation by the National Science Foundation (NSF). Research at the Center is focused on the development of miniature, low-cost, integrated microsystems with far-ranging applications for industry, health care, and the environment. Partner institutions in this venture are Michigan State University (MSU) and Michigan Technological University (MTU). In addition to groundbreaking research in wireless technology and microelectronic systems, ERC/WIMS develops specialized engineering courses, internships, and summer training programs for teachers and students and offers distance-learning opportunities for professionals. The Center also works with the state of Michigan and an industrial partnership program to encourage technology transfer.
- Funding Sources
ERC/WIMS funding for the next 11 years is anticipated to exceed $60 million. First-year funding of $2.5 million was provided by NSF, with an additional $2+ million in contributions from a consortium of global corporations, the state of Michigan, and partner universities. In addition, NSF has committed $16+ million to the Center for five years beginning in 2001.
- Administrative Staff
The Center director and deputy director are from the University of Michigan, with associate directors drawn from MSU and MTU. Completing the staff are an administrative director, an associate director for industrial programs, an associate director for education, and research thrust directors selected from the Center's management committee.
- Advisory Committees
Industrial partners serve on the Center's Executive Committee and Industrial Advisory Board, helping to develop strategies, set direction, and determine policies for education and research.
- Research Thrust Areas
Research is organized into four primary areas:
- Micropower circuits
- Wireless interfaces
- Sensors and microinstruments
- Micropackaging
- Micropower circuits
- Education and Training
The Center has developed a set of teaching aids for middle and high schools and is currently working with science coordinators to create summer training seminars for teachers as well as special programs for underrepresented minority students. The three partner universities are also in the process of developing college-level courses that will facilitate an MEng degree in Integrated Microystems. Ultimately, this series of classes will be offered nationally through distance learning and will involve extensive multimedia and shared virtual laboratory experiences. In addition, ongoing seminars exploring technological advances in microsystems and their implications for society are being presented at university and industrial sites.
- Commercialization and Patents
- Industry Membership
The Center's Industrial Partnership Program involves 25 leading companies and non-profit organizations. Nearly all participants maintain leading-edge research programs in microelectronics, microelectromechanical systems, and wireless communications. In addition to serving on advisory and executive committees, industry partners sponsor named student scholarships and fellowships, provide internships, and participate in corporate personnel/faculty exchanges. Each industry partner pays a minimum of $50,000 per year for access to intellectual property, faculty, students, and facilities at the ERC/WIMS.
For more information, contact:
Joseph M. Giachino
Director of External Programs (Industrial Liaison)
ERC for Wireless Integrated MicroSystems
University of Michigan College of Engineering
204 Engineering Programs Building
2609 Draper
Ann Arbor, MI 48109-2101
(734) 615-3096 phone
(734) 647-2342 fax
giachino@eecs.umich.edu
http://www.eecs.umich.edu/wims
