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New Research Center to Explore Small New Worlds of Wireless Integrated MicroSystems

History in the Making: Michigan Engineering Signs Agreement with Shanghai Jiao Tong University in China

What to Do with Radioactive Waste . . . Michigan Engineers May Have the Answer

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MACE II: The International Space Station’s First Scientific Payload Has Michigan Engineering Stamped on It

NSF Awards College Two Major Information Technology Research Grants

AutoBots Are All the Buzz

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From the Dean

Enginews: A Collection of Brief News Stories About the College of Engineering

ProfFiles: Accomplishments of Michigan Engineering Faculty

Student Spotlight: Michigan Engineering Student
Achievements


Opportunities for Impact

Graduation 2000: Over 1,000 Students Join the Ranks of Michigan Engineering Alumni


Corporate Connections

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Alumni Profiles: Kedrick Adkins (BSE IO ’74)

Alumni Who Have Made a Difference: Leon Jaroff (BSE EE, BS EM ’50)

Alumni News

Emeritus Weekend 2000: Class of ’50E Lives It Up

Alum Notes

In Memoriam

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Michigan Engineer is published two times a year by the University of Michigan College of Engineering for alumni, faculty, students, and friends.

Correspondence may be sent to:
Michigan EngineerUniversity of Michigan College of Engineering
Office of Media and Marketing
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E-mail address:
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Dean Stephen W. Director
Editor Janet Harvey-Clark
Associate Editor Patricia Majher
Art Director/Designer Marie Howard
Designer Hesseltine & DeMason Design
Editorial Assistant Connie Scheibe

Writers
Karl Leif Bates
Linda Fitzgerald
Janet Harvey-Clark
David Horowitz
Candice Liepa
Patricia Majher

Photographers
James C. Bean
Stephen W. Director
G. Randall Goss


Rodney Hill
Per Kjeldsen
Patricia Majher
Michael J. Schimpf
NASA
Martin Vloet
Bill Wood

University of Michigan Regents
David A. Brandon, Ann Arbor
Laurence B. Deitch, Bloomfield Hills
Daniel D. Horning, Grand Haven
Olivia P. Maynard, Goodrich
Rebecca McGowan, Ann Arbor
Andrea Fischer Newman, Ann Arbor
S. Martin Taylor, Grosse Point Farms
Katherine E. White, Ann Arbor
Lee C. Bollinger, ex officio
University of Michigan

College of Engineering

Questions about this web site can be sent to webmaster@engin.umich.edu
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The central background image is an all-silicon ring gyro. The dissolved-wafer process developed at Michigan gave birth to the first-reported integrated gyro in 1993, and in 1994 Michigan reported the first integrated ring gyro. The other images, clockwise from top left and ending with the central foreground image, are: The relative size of these micro objects is shown in comparison to a penny. A programmable wireless chip. The DNA Lab on a Chip. FINESS, a programmable wireless chip for peripheral nerve stimulation. A four-inch glass wafer, produced by the College, can contain over 900 microsystems. A first-generation environmental monitoring microsystem.
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